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Studiendelegierter
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Foreign Applicants
Prof. R. Spolenak, Dr. N. Bühler
3L
1E
4CP
Part I:
Materials for Microelectronics and MEMS/NEMS
This lecture focuses on materials issues in microelectronics and microelectromechanical systems (MEMS). Starting from an introduction of the topic (describing the hierarchy of electronic devices such as base materials, interconnection, microelectronic and optoelectronic components, multichip-modules), various state of the art fabrication routes of microcomponents will be described and illustrated with specific examples (lithographic tools for the micro- and nanoscale, how does a microphotoresist work). The core of the course is the materials behavior in small dimensions. Focus will be laid on scaling of electronic and mechanical properties, thin film mechanics, device reliability and integration issues when dissimilar materials are joined. Advanced characterization techniques specific to microcomponents will be presented. Finally possible future solutions to further miniaturization, such as carbon nanotubes or 3D integration molecular electronics, will be critically discussed. Excursions to microelectronic companies are part of the course.
Part II:
Materials for Optoelectronics
This lecture starts with an outline of the photophysical and photochemical base processes in molecules and solid state systems (polymers, hybrid systems, crystals). Development and application of novel materials for optical telecommunication, optical information processing, optical data storage and data display are then described:
- how CD-R/DVD-R/DVD-ROM/DVD-RW are made and how do they work
- what is ultra-high density optical storage of data
- how do modern displays work
- how do laser printers and ink jet printers work
“Metal Based Thin Films for Electronics”, K. Wetzig and C. M. Schneider (Eds.), Wiley-VCH, 2003
“Thin Film Materials: Stress, Surface Evolution and Failure”, L. B. Freund and S. Suresh, Cambridge University Press, 2003.
More literature will be announced
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